| PART |
Description |
Maker |
| 527249NFP 527249MP 527249BP 527249NFP1 527249NCP1 |
EMI/RFI Shield Sock Backshell with Strain-Relief
|
Glenair, Inc.
|
| 627A122XO16 627F122XO16 627H122XO16 |
Composite Swing-Arm Strain Relief
|
Glenair, Inc.
|
| 447AW711XM08 447AW711XM10 447AW711XM14 447AW711XM1 |
Composite EMI/RFI Banding Backshell with Strain Relief
|
Glenair, Inc.
|
| 447AS329XM08 447FS329XM08 447LS329XM08 447SS329XM0 |
Composite EMI/RFI Environmental Band-in-a-Can Backshell with Strain-Relief Clamp
|
Glenair, Inc.
|
| C8107 |
3 /C 18 AWG Stranded Tinned Copper, FEP Insulation, Overall Aluminum/Polyester Shield, TC Braid Shield, and FEP Jacket
|
General Cable Technologies Corporation
|
| C8108 |
6 /C 16 AWG Stranded Tinned Copper, FEP Insulation, Overall Aluminum/Polyester Shield, TC Braid Shield, and FEP Jacket
|
General Cable Technologies Corporation
|
| XN01211 XN1211 XN01211XN1211 |
SILICON NPN EPITAXIAL PLANER TRANSISTOR
Composite Device - Composite Transistors
|
Panasonic Corporation
Panasonic Semiconductor
|
| XN04210 XN4210 UN1210 UNR1210 |
Composite Device - Composite Transistors
Silicon NPN epitaxial planer transistor
|
PANASONIC[Panasonic Semiconductor]
|
| XN06435 XN06435XN6435 XN6435 |
Composite Device - Composite Transistors
From old datasheet system
XN06435（XN6435-复合晶体
|
Panasonic
|
| XN1C301 XN0C301 |
Composite Device - Composite Transistors
Silicon PNP epitaxial planer transistor (Tr1)
|
Matsshita / Panasonic
PANASONIC[Panasonic Semiconductor]
|
| 0746971104 74697-1104 |
2.00mm (.079) Pitch 5-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 40 Circuits
MOLEX Connector
|
Molex Electronics Ltd.
|
